Michael Patterson
Principal Engineer, Intel Corp., USA
Michael K Patterson is a Senior Power and Thermal Architect
working in the Eco-Technology Program Office in the Data Center and
Connected Systems Group at Intel Corporation, Hillsboro, OR, where
he works on power and thermal solutions for Intel's next-generation
server, client, storage, and communications products.
The work covers silicon level activity, through platform and
rack level solutions, and on up to interface with Data Center power
and cooling technologies. He did his undergraduate work at
Purdue University, received his MS degree in Management from
Rensselaer Polytechnic Institute, and was awarded his MS and PhD in
Mechanical Engineering from the University of Vermont. His
current technical interests include HPC, advanced closed-loop
cooling systems, server power and thermal management technologies,
server/datacenter interaction, and high density data center
concepts.
He has been with Intel for 18 years. He is a registered
Professional Engineer. He is the Chairman of the Data Center
Technology and Strategy Committee for the Green Grid. He is
also a member of ASHRAE TC 9.9 and ASME. He is currently
serving as the Chair of ASHRAE TC 9.9's Research subcommittee.