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Michael Patterson

Principal Engineer, Intel Corp., USA

Michael K Patterson is a Senior Power and Thermal Architect working in the Eco-Technology Program Office in the Data Center and Connected Systems Group at Intel Corporation, Hillsboro, OR, where he works on power and thermal solutions for Intel's next-generation server, client, storage, and communications products. 

The work covers silicon level activity, through platform and rack level solutions, and on up to interface with Data Center power and cooling technologies.  He did his undergraduate work at Purdue University, received his MS degree in Management from Rensselaer Polytechnic Institute, and was awarded his MS and PhD in Mechanical Engineering from the University of Vermont.  His current technical interests include HPC, advanced closed-loop cooling systems, server power and thermal management technologies, server/datacenter interaction, and high density data center concepts. 

He has been with Intel for 18 years.  He is a registered Professional Engineer.  He is the Chairman of the Data Center Technology and Strategy Committee for the Green Grid.  He is also a member of ASHRAE TC 9.9 and ASME.  He is currently serving as the Chair of ASHRAE TC 9.9's Research subcommittee.






 
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